wafer scribing

wafer scribing
wafer scribing Wafer-Ritzen n

English-German dictionary of Electrical Engineering and Electronics. 2013.

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  • Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …   Wikipedia

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