- wafer scribing
- wafer scribing Wafer-Ritzen n
English-German dictionary of Electrical Engineering and Electronics. 2013.
English-German dictionary of Electrical Engineering and Electronics. 2013.
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Laser cutting — process on a sheet of steel. CAD (top) and stainless steel laser cut part (bottom) Laser cutting is a technology that uses a laser to cut materials, an … Wikipedia